GUIDES
Learn how to manage SMT stencil design approval for China PCBA builds. Covers paste layer handoff, foil thickness, aperture modifications for fine-pitch ICs, USB-C, QFNs, and shield cans, plus first-article quality gates.
A technical guide for hardware and engineering leads choosing between press-fit and soldered connectors on China PCBA programs. Covers hole tolerances, plating specs, press tooling, and first-article qualification evidence.
Learn how to select brushed vs. brushless coreless motors, verify continuous torque and thermal limits, and execute a sample evaluation plan before placing volume production orders.
Discover the essential PCBA project kickoff checklist for China EMS builds to prevent delays from mismatched file revisions, unassigned tooling, and vague BOM risk ownership.
A practical guide to choosing between OEM, ODM, JDM, and bring-your-files manufacturing in Shenzhen based on design ownership, engineering resources, launch goals, IP, budget, and production readiness.
Deciding between local and offshore PCBA assembly isn't about choosing a country—it's about matching your build stage to the right manufacturing environment. This guide breaks down when local prototyping wins, when offshore turnkey production delivers cost and scale advantages, and the exact handoff checklist required before switching suppliers.