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Guides

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SMT stencil design approval with a China PCBA partner: paste-layer handoff, thickness, aperture changes and when to re-cut after the first lot

Learn how to manage SMT stencil design approval for China PCBA builds. Covers paste layer handoff, foil thickness, aperture modifications for fine-pitch ICs, USB-C, QFNs, and shield cans, plus first-article quality gates.

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Press-fit vs soldered connectors on China PCBA: hole tolerance, insertion force, and first-article evidence before release

A technical guide for hardware and engineering leads choosing between press-fit and soldered connectors on China PCBA programs. Covers hole tolerances, plating specs, press tooling, and first-article qualification evidence.

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Coreless motor selection and sample evaluation for robot hands, micro-drones and medical devices: brushed vs brushless, continuous torque, life and lot consistency before you order

Learn how to select brushed vs. brushless coreless motors, verify continuous torque and thermal limits, and execute a sample evaluation plan before placing volume production orders.

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Blog

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FAQ

Direct answers to common hardware development questions.

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